Article
Effects of adhesive drying methods to reduce aerosol generation during resin bonding on…
medRxiv · 2021 · Ayar, M. K.; Yesil, O.
Key facts
| Title | Effects of adhesive drying methods to reduce aerosol generation during resin bonding on enamel bond strength |
|---|---|
| First author | Ayar, M. K.; Yesil, O. |
| Journal | medRxiv |
| Published | Apr 1, 2021 |
| DOI | 10.1101/2021.03.31.437826 |
| Devices mentioned | K100347, K101423, K182162, K944286 |
| Product codes mentioned | DYH, DYJ, DYW, DZB, DZC, DZD, DZE, EBZ, ECM, ECN, ECO, EID and 5 more |
At a glance
- 1–9 FDA submissions mentioned
- 10–99 Product codes mentioned
Counts are shown as ranges. Exact figures, trends and every underlying record are available in Orca1.
About Literature
Peer-reviewed and preprint literature indexed by Orca1 and linked to the FDA submissions and product codes each article mentions. Only bibliographic details are shown here.
Source: Publisher and PubMed metadata; device mentions identified by Orca1